Dust and Particles
Dust is harmful to the operation of the DS3001.
Dust may lead to electrostatic adherence, especially under low relative humidity, resulting in poor contact of metal connectors or contacts. Electrostatic adherence may result in reduced product lifespan and increased chance of communication failures. The recommended value for dust content and particle diameter in the site is shown below.
| Max Diameter (µm) | 0.5 | 1 | 3 | 5 |
|
Max Density (particles/m³) | 1.4×105 | 7×105 | 2.4×105 | 1.3×105 |
Airborne salt, acid and sulfide are also harmful to the device. Such harmful gases will aggravate metal corrosion and the aging of some parts. The site should avoid harmful gases, such as SO2, H2S, NO2, NH3 and Cl2, etc. The table below details the threshold values.
| Gas | Average (mg/m³) | Max (mg/m³) |
|---|---|---|
| SO2 | 0.2 | 1.5 |
| H2S | 0.006 | 0.03 |
| NO2 | 0.04 | 0.15 |
| NH3 | 0.05 | 0.15 |
| Cl2 | 0.01 | 0.3 |