Environmental Requirements
- The switch must be installed in a clean, dust-free environment. Otherwise, the device may be damaged by electrostatic adherence.
- Maintain the temperature @airflow front to back within 5 - 40 ºC, and humidity within 40 - 60 %.
- The device must work in the range of AC power input: .
- The device must be installed in a dry and cool place. Leave sufficient spacing around the device for good air circulation.
- The device must be well grounded in order to avoid electrostatic discharge (ESD) damage and physical human injury.
- Avoid direct sunlight and keep the chassis away from heat and strong electromagnetic interference sources.
Dust and Particles
Dust is harmful to the operation of the DS1000.
Dust may lead to electrostatic adherence, especially under low relative humidity, resulting in poor contact of metal connectors or contacts. Electrostatic adherence may result in reduced product lifespan and increased chance of communication failures. The recommended value for dust content and particle diameter in the site is shown below.
Max Diameter (µm) | 0.5 | 1 | 3 | 5 |
Max Density (particles/m³) | 1.4×105 | 7×105 | 2.4×105 | 1.3×105 |
Airborne salt, acid and sulfide are also harmful to the device. Such harmful gases will aggravate metal corrosion and the aging of some parts. The site should avoid harmful gases, such as SO2, H2S, NO2, NH3 and Cl2, etc. The table below details the threshold values.
Gas | Average (mg/m³) | Max (mg/m³) |
---|---|---|
SO2 | 0.2 | 1.5 |
H2S | 0.006 | 0.03 |
NO2 | 0.04 | 0.15 |
NH3 | 0.05 | 0.15 |
Cl2 | 0.01 | 0.3 |
Temperature and Humidity
Although DS1000 is designed to use multiple internal fans, the site should still maintain appropriate temperature and humidity. High-humidity conditions may cause increased electrical resistance and degradation of mechanical properties and corrosion of internal components. Extreme low relative humidity may cause the insulation spacer to contract, making the fastening screw insecure. Furthermore, in dry environments, static electricity is liable to be produced and cause harm to internal circuits. Temperature extremes may cause reduced reliability and premature aging of insulation materials, thus reducing the working lifespan of the Ethernet switch.
Temperature (airflow front to back): | Relative Humidity | ||
---|---|---|---|
Long-term condition | Short-term condition | Long-term condition | Short-term condition |
5 - 40 ºC |
5 - 45 ºC |
40 - 60 % |
5 - 90 % |
Temperature (airflow back to front): |
Relative Humidity | ||
---|---|---|---|
Long-term condition |
Short-term condition |
Long-term condition |
Short-term condition |
5 - 40 ºC |
5 - 45 ºC |
40 - 60 % |
5 - 90 % |
Environmental Requirements Tables
Temperature and Temperature Gradient | ||
---|---|---|
Operating Reliability Requirement | Ambient | 0 to 40º C |
Max Temperature Gradient | 20º C per hour | |
Non-Operating Reliability Requirement | Ambient Non-Operating | -40 to 65 º C |